All Products

<<皮秒/飛秒雷射設備與代工>>
(Picosecond/Femtosecond Laser Equipment and OEM)

(A)高精密皮秒切割機:
應用範圍Application Range：
本機主要用於PI/MPI膜、LCP、覆蓋膜、FPC柔性線路板、COP膜等材料的高品
質鐳射切割、刻槽、開窗。在3C、醫療、汽車等領域有廣泛的應用。
This machine is mainly used for high-quality laser cutting, engraving, and window opening of PI/MPI film, LCP, cover film, FPC flexible circuit board, COP film, and other materials. It has a wide range of applications in 3C, medical, automotive, and other fields.


(B)皮秒雷射消融切割機:
應用範圍Application Range：
設備特點Equipment Feature：
本機主要用於陶瓷\藍寶石\玻璃產品的等透明脆性材料的鐳射消融切割，可廣泛應用於
3C領域指紋模組/攝像頭模組保護蓋等0.5mm厚度以下產品的高速高質切割與開槽應用。
This machine is mainly used for laser ablation cutting of transparent brittle materials such as glass/sapphire/ceramic products.
It can be widely used in high-speed high-quality cutting and slotting of products with a thickness of 0.5mm or less in a 3C field fingerprint module/camera module protection cover.

PI Polyimide Tape(KA200)/PI Tape(KA200)
Polyimide film has stable chemical properties, good heat resistance, chemical resistance, good flame retardancy and good electrical insulation.
Can be used in high temperature or other harsh environments, such as motor slot insulation and cable wrapping.
With silicone, the imide tape can withstand temperature up to 200°C, and it can be removed without residue.
Low flammability with a dielectric strength of 5.2kV. UL certification meets client needs.
Suitable for various industrial purposes, widely used in electronic product process, such as PCB process protection, QFN packaging, etc.

LiB Copper Foil

冠品油墨材料(TeamChem)

三合一壓合材料(Three-in-one Lamination Material)

GS系列銅箔產品
高頻高速低傳輸損耗產品
High Frequency Lower Transmission Loss Product

IPCO Steel Belt & DBP Steel Belt Laminator:
(A) Steel Belt:
Super Mirror Polished Steel Belt Applications: Optical film, PI film, FCCL 2-Layer, etc.
Suitable for FCCL 2-Layer production, with excellent steel strip quality and craftsmanship, ensuring long-term FCCL product production quality.
(B) DBP steel belt pressing machine:
Isochoric = Gap controlled isovolumetric pressing

Polyimide Film for FCCL and FPCs
PI Advanced Materials is supplying PI film as basic material for various fields such as smartphone, semiconductor, IT industry, space, aviation, and industrial power generation.


ㆍHigh Thermal Properties
ㆍMatching CTE with Copper
ㆍ A variety of Thickness (5~75um)
ㆍ FCCL, Coverlay, Stiffener
ㆍInsulating Tape,Label

Type: GF GV GD

Polyimide composite reinforcement film (Stiffener)
* Product Specifications :
* Material Description :
PI composite thickness: 3~9 mil
Type and thickness of adhesive: modified epoxy resin, 25~37.5um
* feature of product :
◎ Excellent flame resistance (flame resistance grade: UL 94V-0, UL File No. E242399)
◎ Excellent adhesion
◎ Excellent heat resistance
◎ Excellent chemical resistance

Advanced P Materials
PI Varnish for Semiconductor
PI Advanced Materials develops and supplies basic materials for future industries such as display,
electric car, and secondary battery industry based on the accumulated varnish
production technology accumulated in PI film production.
Characteristics ㆍSuperior Thermal & Dimensional Stability
ㆍMatching CTE with Semiconductor Materials
Application ㆍSemiconductor
VS-A VS-S VS-E

Solid-state batteries conform to the ESG world trend, are environmentally friendly and sustainable, have a small carbon footprint, are in line with a circular economy, and assist in carbon neutrality.