聚醯亞胺材料(Polyimide; PI)
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FCCL Material軟性銅箔積層板
High-quality and high-performance 2-Layer FCCL:
The application field of electronic products is constantly evolving towards the demand for lightweight, miniaturization, and high performance, driving the rapid development of the FPCB flexible circuit board industry.
The new generation of high quality, high performance 2-layer adhesive-free flexible copper foil laminate (FCCL) has:
*Excellent mechanical strength and softness
*High thermal shock resistance and thermal stability
*Excellent dimensional stability
*Excellent physical and electrical properties
*Excellent optical properties
It is not only used in demanding static and dynamic flex circuits, but is also widely used in high-density flexible boards (HDI), multi-layer boards, rigid-flex composite boards, as well as IC driver packages such as COF and CSP, and can meet the new generation needs of high-frequency and high-speed transmission.
Excellent processing characteristics, both automatic and semi-automatic FPC production equipment can maintain stable quality in various FPCB processes. -
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2-Layer FCCL (Flexible Adhesiveless) 軟性銅箔積層板
Applications
The AZOTEX® series of quality FCCL products are used extensively in high-density FPC and high impedance control, multilayer interconnections and rigid-flex wiring, COF, CSP, BGA, and PDP driver packaging. It doesn’t stop there, however our customers continue to develop new, innovative technologies and we are proud to be part of this process. With AZOTEX® the possibilities really are infinite.
High Thermal Stability
Quantum mechanically optimized, AZOTEX® has a high glass transition temperature (Tg) and remarkable thermal stability. AZOTEX® ’s high operating temperatures ensure that this stability is maintained during flexible circuit processing.
High Dimensional Stability
AZOTEK utilizes the concepts of quantum mechanics to construct very thin flexible copper clad laminates (FCCL) with outstanding dimensional stability. AZOTEX® ’s remarkable stability and strength ensure optimum performance and added reliability in subsequent processing and circuit applications. -
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PI聚醯亞胺膠帶(KA200)/PI Tape(KA200)
PI Polyimide Tape(KA200)/PI Tape(KA200)
Polyimide film has stable chemical properties, good heat resistance, chemical resistance, good flame retardancy and good electrical insulation.
Can be used in high temperature or other harsh environments, such as motor slot insulation and cable wrapping.
With silicone, the imide tape can withstand temperature up to 200°C, and it can be removed without residue.
Low flammability with a dielectric strength of 5.2kV. UL certification meets client needs.
Suitable for various industrial purposes, widely used in electronic product process, such as PCB process protection, QFN packaging, etc. -
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PI膜(PI Film)
Polyimide Film for FCCL and FPCs
PI Advanced Materials is supplying PI film as basic material for various fields such as smartphone, semiconductor, IT industry, space, aviation, and industrial power generation.
ㆍHigh Thermal Properties
ㆍMatching CTE with Copper
ㆍ A variety of Thickness (5~75um)
ㆍ FCCL, Coverlay, Stiffener
ㆍInsulating Tape,Label
Type: GF GV GD -
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補強板(Stiffener)
Polyimide composite reinforcement film (Stiffener)
* Product Specifications :
* Material Description :
PI composite thickness: 3~9 mil
Type and thickness of adhesive: modified epoxy resin, 25~37.5um
* feature of product :
◎ Excellent flame resistance (flame resistance grade: UL 94V-0, UL File No. E242399)
◎ Excellent adhesion
◎ Excellent heat resistance
◎ Excellent chemical resistance -
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PIAM PI Varnish
Advanced P Materials
PI Varnish for Semiconductor
PI Advanced Materials develops and supplies basic materials for future industries such as display,
electric car, and secondary battery industry based on the accumulated varnish
production technology accumulated in PI film production.
Characteristics ㆍSuperior Thermal & Dimensional Stability
ㆍMatching CTE with Semiconductor Materials
Application ㆍSemiconductor
VS-A VS-S VS-E