聚醯亞胺材料(Polyimide; PI)

PI Polyimide Tape(KA200)/PI Tape(KA200)
Polyimide film has stable chemical properties, good heat resistance, chemical resistance, good flame retardancy and good electrical insulation.
Can be used in high temperature or other harsh environments, such as motor slot insulation and cable wrapping.
With silicone, the imide tape can withstand temperature up to 200°C, and it can be removed without residue.
Low flammability with a dielectric strength of 5.2kV. UL certification meets client needs.
Suitable for various industrial purposes, widely used in electronic product process, such as PCB process protection, QFN packaging, etc.

Polyimide Film for FCCL and FPCs
PI Advanced Materials is supplying PI film as basic material for various fields such as smartphone, semiconductor, IT industry, space, aviation, and industrial power generation.


ㆍHigh Thermal Properties
ㆍMatching CTE with Copper
ㆍ A variety of Thickness (5~75um)
ㆍ FCCL, Coverlay, Stiffener
ㆍInsulating Tape,Label

Type: GF GV GD

Polyimide composite reinforcement film (Stiffener)
* Product Specifications :
* Material Description :
PI composite thickness: 3~9 mil
Type and thickness of adhesive: modified epoxy resin, 25~37.5um
* feature of product :
◎ Excellent flame resistance (flame resistance grade: UL 94V-0, UL File No. E242399)
◎ Excellent adhesion
◎ Excellent heat resistance
◎ Excellent chemical resistance

Advanced P Materials
PI Varnish for Semiconductor
PI Advanced Materials develops and supplies basic materials for future industries such as display,
electric car, and secondary battery industry based on the accumulated varnish
production technology accumulated in PI film production.
Characteristics ㆍSuperior Thermal & Dimensional Stability
ㆍMatching CTE with Semiconductor Materials
Application ㆍSemiconductor
VS-A VS-S VS-E