2-Layer FCCL (Flexible Adhesiveless) 軟性銅箔積層板
Applications
The AZOTEX® series of quality FCCL products are used extensively in high-density FPC and high impedance control, multilayer interconnections and rigid-flex wiring, COF, CSP, BGA, and PDP driver packaging. It doesn’t stop there, however our customers continue to develop new, innovative technologies and we are proud to be part of this process. With AZOTEX® the possibilities really are infinite.
High Thermal Stability
Quantum mechanically optimized, AZOTEX® has a high glass transition temperature (Tg) and remarkable thermal stability. AZOTEX® ’s high operating temperatures ensure that this stability is maintained during flexible circuit processing.
High Dimensional Stability
AZOTEK utilizes the concepts of quantum mechanics to construct very thin flexible copper clad laminates (FCCL) with outstanding dimensional stability. AZOTEX® ’s remarkable stability and strength ensure optimum performance and added reliability in subsequent processing and circuit applications.
2-Layer FCCL (Flexible Adhesiveless) 軟性銅箔積層板