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東鋅 <<皮秒雷射設備與代工>>
(Tung Hsin Picosecond Laser Equipment and OEM)
(A)高精密皮秒切割機:
應用範圍Application Range：
本機主要用於PI/MPI膜、LCP、覆蓋膜、FPC柔性線路板、COP膜等材料的高品
質鐳射切割、刻槽、開窗。在3C、醫療、汽車等領域有廣泛的應用。
This machine is mainly used for high-quality laser cutting, engraving, and window opening of PI/MPI film, LCP, cover film, FPC flexible circuit board, COP film, and other materials. It has a wide range of applications in 3C, medical, automotive, and other fields.
(B)皮秒雷射消融切割機:
應用範圍Application Range：
設備特點Equipment Feature：
本機主要用於陶瓷\藍寶石\玻璃產品的等透明脆性材料的鐳射消融切割，可廣泛應用於
3C領域指紋模組/攝像頭模組保護蓋等0.5mm厚度以下產品的高速高質切割與開槽應用。
This machine is mainly used for laser ablation cutting of transparent brittle materials such as glass/sapphire/ceramic products.
It can be widely used in high-speed high-quality cutting and slotting of products with a thickness of 0.5mm or less in a 3C field fingerprint module/camera module protection cover.
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DETAIL
東鋅 <<皮秒雷射設備與代工>>
(Tung Hsin Picosecond Laser Equipment and OEM)
(A)高精密皮秒切割機:
應用範圍Application Range：
本機主要用於PI/MPI膜、LCP、覆蓋膜、FPC柔性線路板、COP膜等材料的高品
質鐳射切割、刻槽、開窗。在3C、醫療、汽車等領域有廣泛的應用。
This machine is mainly used for high-quality laser cutting, engraving, and window opening of PI/MPI film, LCP, cover film, FPC flexible circuit board, COP film, and other materials. It has a wide range of applications in 3C, medical, automotive, and other fields.
(B)皮秒雷射消融切割機:
應用範圍Application Range：
設備特點Equipment Feature：
本機主要用於陶瓷\藍寶石\玻璃產品的等透明脆性材料的鐳射消融切割，可廣泛應用於
3C領域指紋模組/攝像頭模組保護蓋等0.5mm厚度以下產品的高速高質切割與開槽應用。
This machine is mainly used for laser ablation cutting of transparent brittle materials such as glass/sapphire/ceramic products.
It can be widely used in high-speed high-quality cutting and slotting of products with a thickness of 0.5mm or less in a 3C field fingerprint module/camera module protection cover.
