防焊油墨(Solder Mask)

得力油墨材料(Technic Ink Materials)
FPCB Solder Mask Roadmap Drivers
Key Technologies:
ㆍDirect Imaging with a low exposure energy
ㆍCompatibility with High Heat Resistance and High Flexibility
ㆍCoverlay replacement
ㆍRoll to Roll application
TechniFlex LCL1000F/423M U7 ==> TechniFlex LCL1000F1423M U7S
(Next Generation Flexible SM/Coverlay Resist)

PIC感光顯影覆蓋膜 (PIC Photo-imageable Coverlay)
PIC photo-imageable coverlay film can replace photosensitive development ink by lamination.

冠品油墨材料(TeamChem)