FPCB Solder Mask Roadmap Drivers
Key Technologies:
ㆍDirect Imaging with a low exposure energy
ㆍCompatibility with High Heat Resistance and High Flexibility
ㆍCoverlay replacement
ㆍRoll to Roll application
TechniFlex LCL1000F/423M U7 ==> TechniFlex LCL1000F1423M U7S
(Next Generation Flexible SM/Coverlay Resist)
Customers: 臻鼎(ZDT)、嘉聯益(Career)、Mflex、台郡(Flexium)、旗勝(Mektec)...
